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    UNIVERSAL Stencil for Reballing with 55 different compatible types

    Manufacturer: OEM
    BGA Reballing Stencil Template - This repair kit is specially designed for Samsung smartphones. Excellent replacement of IC or BGA rework and reassembly. Finely machined steel sheet that can be heated by a heat gun. The reballing stencil template can be easily and quickly implanted into the BGA / IC. Made of high-quality steel, which is strong and durable, ensures a long service life.
    SKU: 10358
    GTIN: 3456789033277
    Availability: Out of stock
    Delivery date: 1-3 days
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